N-Type SiC ar Si Foshraitheanna Ilchodacha Dia6inch
等级Grád | U 级 | P级 | D级 |
Grád BPD Íseal | Grád Táirgthe | Grád Caochadán | |
直径Trastomhas | 150.0 mm±0.25mm | ||
厚度Tiús | 500 μm±25μm | ||
晶片方向Treoshuíomh Wafer | Lasmuigh den ais : 4.0° i dtreo < 11-20 > ±0.5° le haghaidh 4H-N Ar ais : <0001>±0.5°le haghaidh 4H-SI | ||
íoslódáilÁrasán Bunscoile | {10-10}±5.0° | ||
íoslódáilFad Maol Bunscoile | 47.5 mm ± 2.5 mm | ||
边缘Eisiamh imeall | 3 mm | ||
总厚度变化/弯曲度/翘曲度 TTV/Bow /Warp | ≤15μm / ≤40μm / ≤60μm | ||
微管密度和基面位错MPD&BPD | MPD≤1 cm-2 | MPD≤5 cm-2 | MPD≤15 cm-2 |
BPD≤1000cm-2 | |||
电阻率Friotaíocht | ≥1E5 Ω·cm | ||
表面粗糙度Garbhacht | Polainnis Ra≤1 nm | ||
CMP Ra≤0.5 nm | |||
裂纹(强光灯观测) # | Dada | Fad carnach ≤10mm, fad singil≤2mm | |
Scoilteanna ag solas ard-déine | |||
六方空洞(强光灯观测)* | Achar carnach ≤1% | Achar carnach ≤5% | |
Plátaí Heics ag solas ard-déine | |||
多型(强光灯观测)* | Dada | Achar carnach ≤5% | |
Limistéir Polytype ag solas ard-déine | |||
划痕(强光灯观测)*& | 3 scratches go 1 × trastomhas wafer | 5 scratches go 1 × trastomhas wafer | |
Scratches ag solas ard-déine | fad carnach | fad carnach | |
崩边# Sliseanna imeall | Dada | 5 ceadaithe, ≤1 mm an ceann | |
表面污染物(强光灯观测) | Dada | ||
Éilliú ag solas ard-déine |